Application: | Semiconductor Materials |
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Type: | Resin |
Suitable for: | GaAs, GaN, Sic, Cadmium, Germanium, Zinc etc |
Certificate: | Can Be Customized for by The Destination Country |
Processing Size: | Φ125X400mm |
Cutting Method: | Vertically Downward |
Samples: |
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Customization: |
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